Active packaging technology (1994-96).
I proposed (US Pat. 5,496,743) a new device fabrication technology in which certain essential fabrication steps (lithography, etching, metallization, etc.) are performed after the partially processed device or circuit is packaged onto a host platform. The technique enables a new degree of freedom in manufacturing - lithography on opposite sides of a thin film - and permits the implementation of a variety of new devices and functions with ultra high performance. It also simplifies many schemes for integrating electronic and photonic devices into a single functional unit to be placed within the integrated circuitry on a silicon chip.
For more details, see [ Active Packaging ]
Key papers: 131, 144
Where the numbers refer to the attached list of Publications
[ # 144 PostScript (170K download) ]
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